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| APM2601 P-Channel Enhancement Mode MOSFET Features * -20V/-3A , RDS(ON)=80m(typ.) @ VGS=-4.5V RDS(ON)=110m(typ.) @ VGS=-2.5V Pin Description D D G 1 2 3 6 5 4 D D S * * * Super High Dense Cell Design for Extremely Low RDS(ON) Reliable and Rugged SOT-23-6 Package Top View of SOT-23-6 S Applications * G Power Management in Notebook Computer , Portable Equipment and Battery Powered Systems. DD DD Ordering and Marking Information A P M 26 01 H andling C ode T em p. R an ge Package Code P-Channel MOSFET Package Code C : S O T -23-6 O peration Junction T em p. R ange C : -55 to 1 50 C H andling C ode T R : T ape & R eel A P M 2601 C : M 01X X - D ate C ode Absolute Maximum Ratings Symbol VDSS VGSS ID* IDM Drain-Source Voltage Gate-Source Voltage Parameter (TA = 25C unless otherwise noted) Rating -20 8 -3 -10 Unit V A Maximum Drain Current - Continuous Maximum Drain Current - Pulsed ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise customers to obtain the latest version of relevant information to verify before placing orders. Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 1 www.anpec.com.tw * Surface Mounted on FR4 Board, t 10 sec. APM2601 Absolute Maximum Ratings (Cont.) Symbol PD Parameter Maximum Power Dissipation TA=25C TA=100C TJ TSTG RjA Maximum Junction Temperature Storage Temperature Range Thermal Resistance - Junction to Ambient (TA = 25C unless otherwise noted) Rating 1.25 0.5 150 -55 to 150 100 Unit W C C C/W Electrical Characteristics Symbol Static BVDSS IDSS VGS(th) IGSS RDS(ON)a VSDa b (TA = 25C unless otherwise noted) APM2601 Typ. Max. Min. -20 -1 -0.45 80 110 -0.7 6.4 1 1.8 8 4 20 7 550 265 115 pF 18 10 45 16 -1.2 100 100 135 -1.3 8 nC Parameter Test Condition Unit Drain-Source Breakdown Voltage Zero Gate Voltage Drain Current Gate Threshold Voltage Gate Leakage Current Drain-Source On-state Resistance Diode Forward Voltage VGS=0V , IDS=-250A VDS=-16V , VGS=0V VDS=VGS , IDS=-250A VGS=8V , VDS=0V VGS=-4.5V , IDS=-3A VGS=-2.5V , IDS=-2A ISD=-1.25A , VGS=0V VDS=-10V , IDS=-1A VGS=-4.5V VDD=-10V , IDS=-1A , VGEN=-4.5V , RG=6 V A V nA m V Dynamic Qg Total Gate Charge Qgs Qgd td(ON) Tr td(OFF) Tf Ciss Coss Crss Gate-Source Charge Gate-Drain Charge Turn-on Delay Time Turn-on Rise Time Turn-off Delay Time Turn-off Fall Time Input Capacitance ns VGS=0V Output Capacitance VDS=-15V Reverse Transfer Capacitance Frequency=1.0MHz Notes a b : Pulse test ; pulse width 300s, duty cycle 2% : Guaranteed by design, not subject to production testing Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 2 www.anpec.com.tw APM2601 Typical Characteristics Output Characteristics 10 -VGS=3,4.5,6,7,8V Transfer Characteristics 10 8 -VGS=2V -ID-Drain Current (A) 6 -ID-Drain Current (A) 8 6 TJ=125C 4 -VGS=1.5V 4 2 -VGS=1V 2 TJ=25C TJ=-55C 0 0 1 2 3 4 5 6 7 8 9 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -VDS - Drain-to-Source Voltage (V) -VGS - Gate-to-Source Voltage (V) Threshold Voltage vs. Junction Temperature 1.50 -IDS=250uA On-Resistance vs. Drain Current 0.18 0.16 -VGS(th)-Threshold Voltage (V) (Normalized) RDS(ON)-On-Resistance () 1.25 1.00 0.75 0.50 0.25 0.00 -50 0.14 0.12 0.10 0.08 0.06 0.04 0.02 0.00 0 2 4 6 8 10 -VGS=2.5V -VGS=4.5V -25 0 25 50 75 100 125 150 Tj - Junction Temperature (C) -ID - Drain Current (A) Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 3 www.anpec.com.tw APM2601 Typical Characteristics (Cont.) On-Resistance vs. Gate-to-Source Voltage 0.20 -ID=3A On-Resistance vs. Junction Temperature 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -VGS=4.5V -ID=3A RDS(ON)-On-Resistance () 0.16 0.14 0.12 0.10 0.08 0.06 0.04 1 2 3 4 5 6 7 8 RDS(ON)-On-Resistance () (Normalized) 0.18 0.2 -50 -25 0 25 50 75 100 125 150 -VGS - Gate-to-Source Voltage (V) TJ - Junction Temperature (C) Gate Charge 5 -VDS=10V -ID=1A Capacitance 800 700 Frequency=1MHz -VGS-Gate-Source Voltage (V) 4 Capacitance (pF) 600 500 400 300 200 100 Ciss 3 2 Coss 1 Crss 0 0 2 4 6 8 0 0 5 10 15 20 QG - Gate Charge (nC) -VDS - Drain-to-Source Voltage (V) Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 4 www.anpec.com.tw APM2601 Typical Characteristics (Cont.) Source-Drain Diode Forward Voltage 10 14 12 Single Pulse Power -IS-Source Current (A) 10 Power (W) 1.4 1.6 8 6 4 2 TJ=150C TJ=25C 1 0.0 0.2 0.4 0.6 0.8 1.0 1.2 0 0.01 0.1 1 10 100 -VSD -Source-to-Drain Voltage (V) Time (sec) Normalized Thermal Transient Impedence, Junction to Ambient Normalized Effective Transient Thermal Impedance 1 Duty Cycle=0.5 D=0.2 D=0.1 0.1 D=0.05 D=0.02 1.Duty Cycle, D=t1/t2 2.Per Unit Base=RthJA=100C/W 3.TJM-TA=PDMZthJA SINGLE PULSE D=0.01 0.01 1E-4 1E-3 0.01 0.1 1 10 100 Square Wave Pulse Duration (sec) Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 5 www.anpec.com.tw APM2601 Packaging Information SOT-23-6 D 6 5 4 E H 1 2 3 S1 e D A2 A L1 A1 L2 L D im A A1 A2 b D E e H L L1 L2 S1 M i ll im et er s Min. 1.00 0.00 0.70 0.35 2.70 1.40 1 . 9 0 B SC 2.60 0.30 0.08 0.60 REF 0 0.85 10 1.05 6 Max. 1.45 0.15 1.25 0.55 3.10 1.80 3.00 0.25 In c h e s Min. Max. 0.0394 0.0571 0.0000 0.0591 0.0276 0.0492 0.0138 0.0217 0.1063 0.1220 0.50551 0.0709 0.07480 BSC 0.1024 0 . 11 8 1 0 0 0 11 8 0.0031 0.0098 0.024 REF 0 10 0.0335 0.0413 www.anpec.com.tw Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 APM2601 Physical Specifications Terminal Material Lead Solderability Solder-Plated Copper (Solder Material : 90/10 or 63/37 SnPb) Meets EIA Specification RSI86-91, ANSI/J-STD-002 Category 3. (IR/Convection or VPR Reflow) Reflow Condition Reference JEDEC Standard J-STD-020A APRIL 1999 temperature Peak temperature 183C Pre-heat temperature Time Classification Reflow Profiles Convection or IR/ Convection Average ramp-up rate(183C to Peak) Preheat temperature 125 25C) Temperature maintained above 183C Time within 5C of actual peak temperature Peak temperature range Ramp-down rate Time 25C to peak temperature 3C/second max. 120 seconds max. 60 ~ 150 seconds 10 ~ 20 seconds 220 +5/-0C or 235 +5/-0C 6 C /second max. 6 minutes max. VPR 10 C /second max. 60 seconds 215~ 219C or 235 +5/-0C 10 C /second max. Package Reflow Conditions pkg. thickness 2.5mm and all bags Convection 220 +5/-0 C VPR 215-219 C IR/Convection 220 +5/-0 C pkg. thickness < 2.5mm and pkg. volume 350 mm pkg. thickness < 2.5mm and pkg. volume < 350mm Convection 235 +5/-0 C VPR 235 +5/-0 C IR/Convection 235 +5/-0 C www.anpec.com.tw Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 7 APM2601 Reliability test program Test item SOLDERABILITY HOLT PCT TST Method MIL-STD-883D-2003 MIL-STD 883D-1005.7 JESD-22-B, A102 MIL-STD 883D-1011.9 Description 245C,5 SEC 1000 Hrs Bias @ 125C 168 Hrs, 100% RH, 121C -65C ~ 150C, 200 Cycles Carrier Tape & Reel Dimensions t E Po P P1 D W F Bo Ao D1 T2 Ko J C A B T1 Application A 1781 B C J T1 8.4 2 P1 T2 1.5 0.3 Ao 72 1.0 13.0 + 0.2 2.5 0.15 D D1 1.5 +0.1 Po 4.0 0.1 W 8.0+ 0.3 - 0.3 Bo P 4 0.1 Ko 1.4 0.1 E 1.75 0.1 t 0.20.03 SOT-23-6 F 3.5 0.05 1.5 +0.1 2.0 0.1 3.15 0.1 3.2 0.1 Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 8 www.anpec.com.tw APM2601 Cover Tape Dimensions Application SOT-23-6 Carrier Width 8 Cover Tape Width 5.3 Devices Per Reel 3000 Customer Service Anpec Electronics Corp. Head Office : 5F, No. 2 Li-Hsin Road, SBIP, Hsin-Chu, Taiwan, R.O.C. Tel : 886-3-5642000 Fax : 886-3-5642050 Taipei Branch : 7F, No. 137, Lane 235, Pac Chiao Rd., Hsin Tien City, Taipei Hsien, Taiwan, R. O. C. Tel : 886-2-89191368 Fax : 886-2-89191369 Copyright ANPEC Electronics Corp. Rev. A.1 - Jun., 2003 9 www.anpec.com.tw |
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